文献
J-GLOBAL ID:201002235319748474
整理番号:10A1542907
熱インプリント工程に対する離型力に及ぼす基板変形の影響
Impact of substrate deformation on demolding force for thermal imprint process
著者 (5件):
KAWATA H.
(Graduate School of Engineering, Osaka Prefecture Univ., 1-1 Gakuenchou, Nakaku, Sakai City, Osaka 599-8531, Japan ...)
,
WATANABE Y.
(Graduate School of Engineering, Osaka Prefecture Univ., 1-1 Gakuenchou, Nakaku, Sakai City, Osaka 599-8531, JPN)
,
FUJIKAWA N.
(Graduate School of Engineering, Osaka Prefecture Univ., 1-1 Gakuenchou, Nakaku, Sakai City, Osaka 599-8531, JPN)
,
YASUDA M.
(Graduate School of Engineering, Osaka Prefecture Univ., 1-1 Gakuenchou, Nakaku, Sakai City, Osaka 599-8531, Japan ...)
,
HIRAI Y.
(Graduate School of Engineering, Osaka Prefecture Univ., 1-1 Gakuenchou, Nakaku, Sakai City, Osaka 599-8531, Japan ...)
資料名:
Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
(Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena)
巻:
28
号:
6
ページ:
C6M77
発行年:
2010年11月
JST資料番号:
E0974A
ISSN:
2166-2746
CODEN:
JVTBD9
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)