文献
J-GLOBAL ID:201002298713756867
整理番号:10A0952209
銅基板上のIn-Bi-Sn鉛フリーはんだ合金のぬれ性と強度
Wettability and strength of In-Bi-Sn lead-free solder alloy on copper substrate
著者 (6件):
NOOR Ervina Efzan Mhd
(School of Material and Mineral Resources, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang ...)
,
SHARIF Nurulakmal Mohd
(School of Material and Mineral Resources, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang ...)
,
YEW Cheong Kuan
(School of Material and Mineral Resources, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang ...)
,
ARIGA Tadashi
(Dep. of Materials Sci., School of Engineering, Tokai Univ., 1117 Kitakaname, Hiratsuka-shi, Kanagawa, JPN)
,
ISMAIL Ahmad Badri
(School of Material and Mineral Resources, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang ...)
,
HUSSAIN Zuhailawati
(School of Material and Mineral Resources, Engineering Campus, Universiti Sains Malaysia, 14300 Nibong Tebal, Penang ...)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
507
号:
1
ページ:
290-296
発行年:
2010年09月24日
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)