文献
J-GLOBAL ID:201202240941949469
整理番号:12A1001228
パッケージ応力評価および信頼性特性化のためのモジュラ・センサ・チップ設計
Modular sensor chip design for package stress evaluation and reliability characterisation
著者 (5件):
TRIGG A.d.
(Inst. of Microelectronics, A*STAR (Agency for Sci., Technol. and Research), 11 Sci. Park Road, Singapore ...)
,
CHAI Tai Chong
(Inst. of Microelectronics, A*STAR (Agency for Sci., Technol. and Research), 11 Sci. Park Road, Singapore ...)
,
ZHANG Xiaowu
(Inst. of Microelectronics, A*STAR (Agency for Sci., Technol. and Research), 11 Sci. Park Road, Singapore ...)
,
CHEN Xian Tong
(Inst. of Microelectronics, A*STAR (Agency for Sci., Technol. and Research), 11 Sci. Park Road, Singapore ...)
,
WAI Leong Ching
(Inst. of Microelectronics, A*STAR (Agency for Sci., Technol. and Research), 11 Sci. Park Road, Singapore ...)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
52
号:
8
ページ:
1581-1585
発行年:
2012年08月
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)