文献
J-GLOBAL ID:201202251243528810
整理番号:12A0111182
Cu/Sn/PdとNi/Sn/Pdサンドイッチはんだ接合構造の交差相互作用の調査
Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures
著者 (5件):
LU C. T.
(National Central Univ., Dep. of Chemical Engineering and Materials Engineering, 32001, Jhongli, Taiwan, TWN)
,
HUANG T.S.
(National Central Univ., Dep. of Chemical Engineering and Materials Engineering, 32001, Jhongli, Taiwan, TWN)
,
CHENG C.H.
(National Central Univ., Dep. of Chemical Engineering and Materials Engineering, 32001, Jhongli, Taiwan, TWN)
,
TSENG H.W.
(National Central Univ., Dep. of Chemical Engineering and Materials Engineering, 32001, Jhongli, Taiwan, TWN)
,
LIU C.Y.
(National Central Univ., Dep. of Chemical Engineering and Materials Engineering, 32001, Jhongli, Taiwan, TWN)
資料名:
Journal of Electronic Materials
(Journal of Electronic Materials)
巻:
41
号:
1
ページ:
130-137
発行年:
2012年01月
JST資料番号:
D0277B
ISSN:
0361-5235
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)