文献
J-GLOBAL ID:201202261990554213
整理番号:12A0957624
金属-ペンタセン接合におけるFermiレベルピニング現象に及ぼす製作後の熱アニーリングの効果
Effect of post-fabrication thermal annealing on Fermi-level pinning phenomenon in metal-pentacene junctions
著者 (7件):
JEONG Seong-guk
(School of Information and Communication Engineering, Sungkyunkwan Univ., Suwon 440-746, KOR)
,
PARK Hyung-youl
(School of Information and Communication Engineering, Sungkyunkwan Univ., Suwon 440-746, KOR)
,
LIM Myung-hoon
(School of Information and Communication Engineering, Sungkyunkwan Univ., Suwon 440-746, KOR)
,
JUNG Woo-shik
(Dep. of Electrical Engineering, Stanford Univ., Stanford, CA 94305, USA)
,
YU Hyun-yong
(School of Electrical Engineering, Korea Univ., Seoul 136-701, KOR)
,
ROH Yonghan
(School of Information and Communication Engineering, Sungkyunkwan Univ., Suwon 440-746, KOR)
,
PARK Jin-hong
(School of Information and Communication Engineering, Sungkyunkwan Univ., Suwon 440-746, KOR)
資料名:
Organic Electronics
(Organic Electronics)
巻:
13
号:
9
ページ:
1511-1515
発行年:
2012年09月
JST資料番号:
W1352A
ISSN:
1566-1199
資料種別:
逐次刊行物 (A)
記事区分:
短報
発行国:
オランダ (NLD)
言語:
英語 (EN)