文献
J-GLOBAL ID:201202267799772080
整理番号:12A0840033
低温ボンディングアプリケーション用の高分子保護したCu-Ag混合NPs
Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application
著者 (7件):
YAN Jianfeng
(Tsinghua Univ., Dep. of Mechanical Engineering, Key Lab. for Advanced Manufacturing by Materials Processing Technol. ...)
,
ZOU Guisheng
(Tsinghua Univ., Dep. of Mechanical Engineering, Key Lab. for Advanced Manufacturing by Materials Processing Technol. ...)
,
WU Aiping
(Tsinghua Univ., Dep. of Mechanical Engineering, Key Lab. for Advanced Manufacturing by Materials Processing Technol. ...)
,
REN Jialie
(Tsinghua Univ., Dep. of Mechanical Engineering, Key Lab. for Advanced Manufacturing by Materials Processing Technol. ...)
,
HU Anming
(Univ. of Waterloo, Dep. of Mechanical and Mechatronics Engineering, Centre of Advanced Materials for Joining, 200 ...)
,
ZHOU Y. Norman
(Tsinghua Univ., Dep. of Mechanical Engineering, Key Lab. for Advanced Manufacturing by Materials Processing Technol. ...)
,
ZHOU Y. Norman
(Univ. of Waterloo, Dep. of Mechanical and Mechatronics Engineering, Centre of Advanced Materials for Joining, 200 ...)
資料名:
Journal of Electronic Materials
(Journal of Electronic Materials)
巻:
41
号:
7
ページ:
1886-1892
発行年:
2012年07月
JST資料番号:
D0277B
ISSN:
0361-5235
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)