文献
J-GLOBAL ID:201202283125064387
整理番号:12A1754341
湿式洗浄はパターン崩壊メカニズム研究を誘導する
Wet Clean Induce Pattern Collapse Mechanism Study
著者 (12件):
YANG C. C.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
KO C. C.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
OUYANG H.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
CHEN K. F.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
PENG Y. Y.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
LIOU J. W.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
CHOU C. C.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
TSAI H. Y.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
LIN K. C.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
JENG S. M.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
TAO H. J.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
,
CAO M.
(Taiwan Semiconductor Manufacturing Co. Ltd, HsinChu, TWN)
資料名:
Diffusion and Defect Data Part B. Solid State Phenomena
(Diffusion and Defect Data Part B. Solid State Phenomena)
巻:
187
ページ:
253-256
発行年:
2012年
JST資料番号:
T0583A
ISSN:
1012-0394
資料種別:
逐次刊行物 (A)
発行国:
スイス (CHE)
言語:
英語 (EN)