文献
J-GLOBAL ID:201202291391413845
整理番号:12A0810738
3D積層フリップチップパッケージのカプセル化でのボイド形成に及ぼす積層チップと入口位置の影響
Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package
著者 (4件):
KHOR C.y.
(School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia)
,
ABDULLAH M.z.
(School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia)
,
ARIFF Z.m.
(School of Material and Mineral Resources, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang ...)
,
LEONG W.c.
(School of Mechanical Engineering, Universiti Sains Malaysia, Engineering Campus, 14300 Nibong Tebal, Penang, Malaysia)
資料名:
International Communications in Heat and Mass Transfer
(International Communications in Heat and Mass Transfer)
巻:
39
号:
5
ページ:
670-680
発行年:
2012年05月
JST資料番号:
H0300B
ISSN:
0735-1933
CODEN:
IHMTDL
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)