文献
J-GLOBAL ID:201302263892691768
整理番号:13A1432214
CMPプロセスにおける材料除去均一性への,リテイニングリングと研磨パッドとの間の接触角度の効果
Effect of contact angle between retaining ring and polishing pad on material removal uniformity in CMP process
著者 (5件):
PARK Yeongbong
(Pusan National Univ., Graduate School of Mechanical Engineering, Jangjeon-dong, Gumjung-gu, 609-735, Busan, KOR)
,
LEE Hyunseop
(Pusan National Univ., Graduate School of Mechanical Engineering, Jangjeon-dong, Gumjung-gu, 609-735, Busan, KOR)
,
LEE Youngkyun
(Pusan National Univ., Graduate School of Mechanical Engineering, Jangjeon-dong, Gumjung-gu, 609-735, Busan, KOR)
,
PARK Sunjoon
(Pusan National Univ., Graduate School of Mechanical Engineering, Jangjeon-dong, Gumjung-gu, 609-735, Busan, KOR)
,
JEONG Haedo
(Pusan National Univ., Graduate School of Mechanical Engineering, Jangjeon-dong, Gumjung-gu, 609-735, Busan, KOR)
資料名:
International Journal of Precision Engineering and Manufacturing
(International Journal of Precision Engineering and Manufacturing)
巻:
14
号:
9
ページ:
1513-1518
発行年:
2013年09月
JST資料番号:
A1070A
ISSN:
2234-7593
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
韓国 (KOR)
言語:
英語 (EN)