文献
J-GLOBAL ID:201302268261344456
整理番号:13A0083396
発光素子熱管理におけるパーコレーション制御からの高導電性ダイアタッチ付着及びその応用
Highly conductive die attach adhesive from percolation control and its applications in light-emitting device thermal management
著者 (8件):
ZHANG Xinfeng
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
ZHANG Kai
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
ZHANG Min
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
YANG Chen
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
SUN Hongye
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
GAO Zhaoli
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
YUEN Matthew M. F.
(Dep. of Mechanical Engineering, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
,
YANG Shihe
(Dep. of Chemistry, The Hong Kong Univ. of Sci. and Technol., Clear Water Bay, Kowloon, Hong Kong)
資料名:
Applied Physics Letters
(Applied Physics Letters)
巻:
102
号:
1
ページ:
014101-014101-5
発行年:
2013年01月07日
JST資料番号:
H0613A
ISSN:
0003-6951
CODEN:
APPLAB
資料種別:
逐次刊行物 (A)
記事区分:
短報
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)