文献
J-GLOBAL ID:201302285822833186
整理番号:13A1227608
微細ピッチフリップチップ組立の異なる熱履歴でのSn-Ag-Cuはんだ合金金属間化合物成長の比較
Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-PitchFlip-Chip Assemblies
著者 (6件):
TIAN Ye
(Huazhong Univ. of Sci. and Technol., School of Materials Sci. and Engineering, 430074, Wuhan, CHN)
,
TIAN Ye
(Georgia Inst. of Technol., The George W. Woodruff School of Mechanical Engineering, 30332, Atlanta, GA, USA)
,
LIU Xi
(Georgia Inst. of Technol., The George W. Woodruff School of Mechanical Engineering, 30332, Atlanta, GA, USA)
,
CHOW Justin
(Georgia Inst. of Technol., The George W. Woodruff School of Mechanical Engineering, 30332, Atlanta, GA, USA)
,
WU Yi Ping
(Huazhong Univ. of Sci. and Technol., School of Materials Sci. and Engineering, 430074, Wuhan, CHN)
,
SITARAMAN Suresh K.
(Georgia Inst. of Technol., The George W. Woodruff School of Mechanical Engineering, 30332, Atlanta, GA, USA)
資料名:
Journal of Electronic Materials
(Journal of Electronic Materials)
巻:
42
号:
8
ページ:
2724-2731
発行年:
2013年08月
JST資料番号:
D0277B
ISSN:
0361-5235
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)