文献
J-GLOBAL ID:201302290749786003
整理番号:13A1466266
シリコンとガラス基板への銅電極のコールドスプレー堆積
Cold Spray Deposition of Copper Electrodes on Silicon and Glass Substrates
著者 (11件):
KIM Do-Yeon
(Korea Univ., School of Mechanical Engineering, 136-713, Seoul, KOR)
,
PARK Jung-Jae
(Korea Univ., School of Mechanical Engineering, 136-713, Seoul, KOR)
,
LEE Jong-Gun
(Korea Univ., School of Mechanical Engineering, 136-713, Seoul, KOR)
,
KIM Donghwan
(Korea Univ., School of Materials Sci. and Engineering, 136-713, Seoul, KOR)
,
TARK Sung Ju
(Korea Univ., School of Materials Sci. and Engineering, 136-713, Seoul, KOR)
,
AHN Sejin
(Korea Inst. of Energy Res., Photovoltaic Res. Center, 71-2 Jang-Dong, Yuseong-Gu, 305-343, Daejeon, KOR)
,
YUN Jae Ho
(Korea Inst. of Energy Res., Photovoltaic Res. Center, 71-2 Jang-Dong, Yuseong-Gu, 305-343, Daejeon, KOR)
,
GWAK Jihye
(Korea Inst. of Energy Res., Photovoltaic Res. Center, 71-2 Jang-Dong, Yuseong-Gu, 305-343, Daejeon, KOR)
,
YOON Kyung Hoon
(Korea Inst. of Energy Res., Photovoltaic Res. Center, 71-2 Jang-Dong, Yuseong-Gu, 305-343, Daejeon, KOR)
,
CHANDRA Sanjeev
(Univ. of Toronto, Dep. of Mechanical and Industrial Engineering, Toronto, ON, CAN)
,
YOON Sam S.
(Korea Univ., School of Mechanical Engineering, 136-713, Seoul, KOR)
資料名:
Journal of Thermal Spray Technology
(Journal of Thermal Spray Technology)
巻:
22
号:
7
ページ:
1092-1102
発行年:
2013年10月
JST資料番号:
W0482A
ISSN:
1059-9630
CODEN:
JTTEE5
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)