文献
J-GLOBAL ID:201302292699173695
整理番号:13A1087895
Effects of annealing and current stressing on the intermetallic compounds growth kinetics of Cu/thin Sn/Cu bump
著者 (4件):
JEONG Myeong-hyeok
(School of Materials Sci. and Engineering, Andong National Univ., Andong 760-749, KOR)
,
KIM Jae-won
(School of Materials Sci. and Engineering, Andong National Univ., Andong 760-749, KOR)
,
KWAK Byung-hyun
(School of Materials Sci. and Engineering, Andong National Univ., Andong 760-749, KOR)
,
PARK Young-bae
(School of Materials Sci. and Engineering, Andong National Univ., Andong 760-749, KOR)
資料名:
Microelectronic Engineering
(Microelectronic Engineering)
巻:
89
ページ:
50-54
発行年:
2012年01月
JST資料番号:
C0406B
ISSN:
0167-9317
CODEN:
MIENEF
資料種別:
逐次刊行物 (A)
発行国:
オランダ (NLD)
言語:
英語 (EN)