文献
J-GLOBAL ID:201502207678459007
整理番号:15A0948480
高信頼性電子/電気材料のためのCu合金上のSn/Ag3Sn多層電気めっき
Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High Reliable Electronic/Electric Materials
著者 (8件):
KURE-CHU Song-zhu
(Fac. of Engineering, Iwate Univ.)
,
OGASAWARA Tohru
(Fac. of Engineering, Iwate Univ.)
,
YASHIRO Hitoshi
(Fac. of Engineering, Iwate Univ.)
,
YE Rongbin
(Fac. of Engineering, Iwate Univ.)
,
HOSOKAI Takuya
(Fac. of Engineering, Iwate Univ.)
,
UCHIDATE Michimasa
(Fac. of Engineering, Iwate Univ.)
,
SUZIKI Eiichi
(Fac. of Engineering, Iwate Univ.)
,
NAITO Tomoyuki
(Fac. of Engineering, Iwate Univ.)
資料名:
Transactions of the Japan Institute of Electronics Packaging (Web)
(Transactions of the Japan Institute of Electronics Packaging (Web))
巻:
7
号:
1
ページ:
79-86 (J-STAGE)
発行年:
2014年
JST資料番号:
U0592A
ISSN:
1884-8028
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
日本 (JPN)
言語:
英語 (EN)