文献
J-GLOBAL ID:201502209064461105
整理番号:15A0903863
B4Cナノ粒子の分散によるBi-Te基合金の硬化
Hardening of Bi-Te based alloys by dispersing B4C nanoparticles
著者 (16件):
JUNG Sung-Jin
(Center for Electronic Materials, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
JUNG Sung-Jin
(Dep. of Materials Sci. and Engineering, Yonsei Univ., Seoul 120-749, KOR)
,
PARK Sun-Young
(School of Materials and Sci. Engineering, UNIST, Ulsan 689-798, KOR)
,
KIM Byung Kyu
(High Temp. Energy Materials Res. Center, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
KWON Beomjin
(Center for Electronic Materials, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
KIM Seong Keun
(Center for Electronic Materials, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
KIM Seong Keun
(Dep. of Nanomaterials Sci. and Technol., Univ. of Sci. and Technol., Daejeon 305-333, KOR)
,
PARK Hyung-Ho
(Dep. of Materials Sci. and Engineering, Yonsei Univ., Seoul 120-749, KOR)
,
KIM Dong-Ik
(High Temp. Energy Materials Res. Center, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
KIM Ju-Young
(School of Materials and Sci. Engineering, UNIST, Ulsan 689-798, KOR)
,
KIM Ju-Young
(KIST-UNIST Ulsan Center for Convergent Materials, UNIST, Ulsan 689-798, KOR)
,
HYUN Dow-Bin
(Center for Electronic Materials, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
KIM Jin-Sang
(Center for Electronic Materials, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
BAEK Seung-Hyub
(Center for Electronic Materials, Korea Inst. of Sci. and Technol., Seoul 136-791, KOR)
,
BAEK Seung-Hyub
(Dep. of Nanomaterials Sci. and Technol., Univ. of Sci. and Technol., Daejeon 305-333, KOR)
,
BAEK Seung-Hyub
(KIST-UNIST Ulsan Center for Convergent Materials, UNIST, Ulsan 689-798, KOR)
資料名:
Acta Materialia
(Acta Materialia)
巻:
97
ページ:
68-74
発行年:
2015年09月15日
JST資料番号:
A0316A
ISSN:
1359-6454
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)