文献
J-GLOBAL ID:201502211688604761
整理番号:15A0556267
ポストCMP in situクリーニングにおけるクロスコンタミネーション効果の研究
Study of the cross contamination effect on post CMP in situ cleaning process
著者 (6件):
KIM Hong Jin
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA)
,
BOHRA Girish
(Technol. Dev. Yield Enhancement (TDYE), GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA)
,
YANG Hyucksoo
(Technol. Dev. Yield Enhancement (TDYE), GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA)
,
AHN Si-Gyung
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA)
,
QIN Liqiao
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA)
,
KOLI Dinesh
(Advanced Module Engineering (AME), GLOBALFOUNDRIES, 400 Stone Break Road Extension, Malta, NY 12020, USA)
資料名:
Microelectronic Engineering
(Microelectronic Engineering)
巻:
136
ページ:
36-41
発行年:
2015年03月25日
JST資料番号:
C0406B
ISSN:
0167-9317
CODEN:
MIENEF
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)