文献
J-GLOBAL ID:201502214535472092
整理番号:15A0976330
高速熱処理によるSn3.0Ag0.5Cu/Cu半田継手中のボイド核発生の抑制
Suppression of void nucleation in Sn3.0Ag0.5Cu/CU solder joint by rapid thermal processing
著者 (6件):
LI Hailong
(State Key Lab. of Advanced Welding and Joining, Harbin Inst. of Technol., Harbin 150001, CHN)
,
AN Rong
(State Key Lab. of Advanced Welding and Joining, Harbin Inst. of Technol., Harbin 150001, CHN)
,
AN Rong
(Key Lab. of Micro-systems and Micro-structures Manufacturing, Ministry of Education, Harbin Inst. of Technol. ...)
,
WANG Chunqing
(State Key Lab. of Advanced Welding and Joining, Harbin Inst. of Technol., Harbin 150001, CHN)
,
WANG Chunqing
(Key Lab. of Micro-systems and Micro-structures Manufacturing, Ministry of Education, Harbin Inst. of Technol. ...)
,
LI Bin
(Delta Power Electronics Center, Delta Electronics (Shanghai) Co., Ltd., Shanghai201209, CHN)
資料名:
Materials Letters
(Materials Letters)
巻:
158
ページ:
252-254
発行年:
2015年11月01日
JST資料番号:
E0935A
ISSN:
0167-577X
資料種別:
逐次刊行物 (A)
記事区分:
短報
発行国:
オランダ (NLD)
言語:
英語 (EN)