文献
J-GLOBAL ID:201502245058059503
整理番号:15A0109195
錫ホイスカ形成に及ぼす電気めっきパラメータ及び基板材料の影響
The effect of electroplating parameters and substrate material on tin whisker formation
著者 (6件):
ASHWORTH M.a.
(Dep. of Materials, Loughborough Univ., Loughborough, Leicestershire LE11 3TU, GBR)
,
WILCOX G.d.
(Dep. of Materials, Loughborough Univ., Loughborough, Leicestershire LE11 3TU, GBR)
,
HIGGINSON R.l.
(Dep. of Materials, Loughborough Univ., Loughborough, Leicestershire LE11 3TU, GBR)
,
HEATH R.j.
(Dep. of Materials, Loughborough Univ., Loughborough, Leicestershire LE11 3TU, GBR)
,
LIU C.
(School of Mechanical and Manufacturing Engineering, Loughborough Univ., Loughborough, Leicestershire LE11 3TU, GBR)
,
MORTIMER R.j.
(Dep. of Chemistry, Loughborough Univ., Loughborough, Leicestershire LE11 3TU, GBR)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
55
号:
1
ページ:
180-191
発行年:
2015年01月
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)