文献
J-GLOBAL ID:201502256401882735
整理番号:14A1433159
電流応力印加下での非対称Cu/Sn-58Bi/Cu半田付け配線のエレクトロマイグレーション誘起ミクロ組織変化と損傷
Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing
著者 (5件):
Yue Wu
(School of Materials Sci. and Engineering, South China Univ. of Technol., Guangzhou)
,
Qin Hongbo
(School of Materials Sci. and Engineering, South China Univ. of Technol., Guangzhou)
,
Zhou Minbo
(School of Materials Sci. and Engineering, South China Univ. of Technol., Guangzhou)
,
Ma Xiao
(School of Materials Sci. and Engineering, South China Univ. of Technol., Guangzhou)
,
Zhang Xinping
(School of Materials Sci. and Engineering, South China Univ. of Technol., Guangzhou)
資料名:
Transactions of Nonferrous Metals Society of China
(Transactions of Nonferrous Metals Society of China)
巻:
24
号:
5
ページ:
1619-1628
発行年:
2014年
JST資料番号:
W0396A
ISSN:
1003-6326
CODEN:
TNMCEW
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
中国 (CHN)
言語:
英語 (EN)