文献
J-GLOBAL ID:201502270175408190
整理番号:15A0274874
Cu(Zn)基板上に電気めっきした薄いSn膜の微細構造進展とホイスカ成長の可能性
Microstructural Development and Possible Whiskering Behavior of Thin Sn Films Electrodeposited on Cu(Zn) Substrates
著者 (7件):
STEIN J.
(Max Planck Inst. for Intelligent Systems (Formerly Max Planck Inst. for Metals Research), Heisenbergstr. 3, 70569 ...)
,
STEIN J.
(Robert Bosch GmbH, Automotive Electronics/Engineering Assembly Interconnection Technol. (AE/EAI2), Robert-Bosch-Str. ...)
,
TINEO C. A. Cordova
(Univ. of Stuttgart, Inst. for Materials Sci., 70569, Stuttgart, DEU)
,
WELZEL U.
(Max Planck Inst. for Intelligent Systems (Formerly Max Planck Inst. for Metals Research), Heisenbergstr. 3, 70569 ...)
,
HUEGEL W.
(Robert Bosch GmbH, Automotive Electronics/Engineering Assembly Interconnection Technol. (AE/EAI2), Robert-Bosch-Str. ...)
,
MITTEMEIJER E. J.
(Max Planck Inst. for Intelligent Systems (Formerly Max Planck Inst. for Metals Research), Heisenbergstr. 3, 70569 ...)
,
MITTEMEIJER E. J.
(Univ. of Stuttgart, Inst. for Materials Sci., 70569, Stuttgart, DEU)
資料名:
Journal of Electronic Materials
(Journal of Electronic Materials)
巻:
44
号:
3
ページ:
886-894
発行年:
2015年03月
JST資料番号:
D0277B
ISSN:
0361-5235
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)