文献
J-GLOBAL ID:201502270262623390
整理番号:15A0497521
鉛フリーはんだ付の応力緩和挙動
Stress relaxation behavior of lead-free solder joint
著者 (3件):
ZHU Yongxin
(Beijing Univ. of Technol., School of Materials Sci. and Engineering, 100 Ping Le Yuan, Chaoyang District, 100024 ...)
,
LI Xiaoyan
(Beijing Univ. of Technol., School of Materials Sci. and Engineering, 100 Ping Le Yuan, Chaoyang District, 100024 ...)
,
GAO Ruiting
(Beijing Univ. of Technol., School of Materials Sci. and Engineering, 100 Ping Le Yuan, Chaoyang District, 100024 ...)
資料名:
Journal of Materials Science. Materials in Electronics
(Journal of Materials Science. Materials in Electronics)
巻:
26
号:
5
ページ:
3020-3024
発行年:
2015年05月
JST資料番号:
W0003A
ISSN:
0957-4522
CODEN:
JMTSAS
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)