文献
J-GLOBAL ID:201602201075366356
整理番号:15A1326731
エポキシ樹脂/ポリアミド系の硬化過程の解析【Powered by NICT】
Analysis on curing process of epoxy resin/polyamide system
著者 (5件):
Chen Ping
(School of Mechanical Engineering, Univ. of Sci. and Technol. Beijing, Beijing)
,
Zhao Hailin
(School of Mechanical Engineering, Univ. of Sci. and Technol. Beijing, Beijing)
,
Ma Feng
(School of Mechanical Electronic and Information Engineering, China Univ. of Mining and Technology(Beijing), Beijing)
,
Shi Xiaowen
(School of Mechanical Engineering, Univ. of Sci. and Technol. Beijing, Beijing)
,
Sha Xiaohua
(School of Mechanical Engineering, Univ. of Sci. and Technol. Beijing, Beijing)
資料名:
Gongneng Cailiao
(Gongneng Cailiao)
巻:
46
号:
15
ページ:
15105-15108
発行年:
2015年
JST資料番号:
C2095A
ISSN:
1001-9731
CODEN:
GOCAEA
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
中国 (CHN)
言語:
中国語 (ZH)