文献
J-GLOBAL ID:201602213323382582
整理番号:15A1358985
粉末冶金法で作製したCu/Invar電子パッケージング複合材料のミクロ組織と性質に及ぼす圧延及び焼なましの影響【Powered by NICT】
Effects of rolling and annealing on microstructures and properties of Cu/Invar electronic packaging composites prepared by powder metallurgy
著者 (5件):
Wu Dan
(School of Materials Sci. and Engineering, Hefei Univ. of Technol., Hefei)
,
Yang Lei
(43 Inst., China Electronics Technol. Group Corp., Hefei)
,
Shi Changdong
(43 Inst., China Electronics Technol. Group Corp., Hefei)
,
Wu Yucheng
(Heifei Univ. of Technol. Key Lab. of Functional Materials and Devices of Anhui Province, Hefei)
,
Tang Wenming
(School of Materials Sci. and Engineering, Hefei Univ. of Technol. Key Lab. of Functional Materials and Devices of ...)
資料名:
Transactions of Nonferrous Metals Society of China
(Transactions of Nonferrous Metals Society of China)
巻:
25
号:
6
ページ:
1995-2002
発行年:
2015年
JST資料番号:
W0396A
ISSN:
1003-6326
CODEN:
TNMCEW
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
中国 (CHN)
言語:
英語 (EN)