文献
J-GLOBAL ID:201602263552235344
整理番号:13A0532271
Microstructure and barrier performance of Ta/Ti-Al integrated film used as a barrier layer for Cu metallization
著者 (7件):
Ren Guoqiang
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
,
Xing Jinzhu
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
,
Li Xiaohong
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
,
Guo Jianxin
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
,
Dai Xiuhong
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
,
Yang Baozhu
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
,
Zhao Qingxun
(Coll. of Physics Sci. and Technol.,Hebei Universtiy, Baoding)
資料名:
Gongneng Cailiao
(Gongneng Cailiao)
巻:
43
号:
4
ページ:
462-464
発行年:
2012年
JST資料番号:
C2095A
ISSN:
1001-9731
CODEN:
GOCAEA
資料種別:
逐次刊行物 (A)
発行国:
中国 (CHN)
言語:
中国語 (ZH)