文献
J-GLOBAL ID:201602274274108245
整理番号:16A0653136
フレキシブルチップ箔パッケージおよび再発性曲げ信頼性解析における超薄ICデバイスの埋め込みと相互接続のための新しい処理手法【Powered by NICT】
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
著者 (9件):
Landesberger C.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Palavesam N.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Hell W.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Drost A.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Faul R.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Gieser H.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Bonfert D.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
,
Bock K.
(Technische Universitaet Dresden, 01069, Germany)
,
Kutter C.
(Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, 80686 Munich, Germany)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
ICEP
ページ:
473-478
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)