文献
J-GLOBAL ID:201602277597132266
整理番号:16A0679398
Cu/低K配線のための低による抵抗性と低コストPVD TiZrN障壁【Powered by NICT】
Low-via-resistance and low-cost PVD-TiZrN barrier for Cu/low-K interconnects
著者 (6件):
Yu-Chen Chan
(Advanced Interconnect Development Program, Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, Taiwan)
,
Chao-Hsien Peng
(Advanced Interconnect Development Program, Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, Taiwan)
,
Ming-Han Lee
(Advanced Interconnect Development Program, Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, Taiwan)
,
Shin-Yi Yang
(Advanced Interconnect Development Program, Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, Taiwan)
,
Ching-Fu Yeh
(Advanced Interconnect Development Program, Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, Taiwan)
,
Shau-Lin Shue
(Advanced Interconnect Development Program, Taiwan Semiconductor Manufacturing Co, Ltd., Hsinchu, Taiwan)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
IITC/AMC
ページ:
174-176
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)