文献
J-GLOBAL ID:201602289512512617
整理番号:16A0740835
Niを被覆したグラフェンナノシートで強化された新しいSn-Ag-Cu無鉛はんだの微細組織と特性
Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets
著者 (6件):
Chen Guang
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China)
,
Chen Guang
(Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, UK)
,
Wu Fengshun
(State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China)
,
Liu Changqing
(Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, UK)
,
Silberschmidt Vadim V.
(Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, UK)
,
Chan Y.C.
(Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, KowLoon Tong, Hong Kong)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
656
ページ:
500-509
発行年:
2016年01月25日
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)