文献
J-GLOBAL ID:201602290858809310
整理番号:16A1065864
チップオンボード発光ダイオードのための呼気図形法による多孔質膜に基づくマイクロレンズアレイ封止層の作製【Powered by NICT】
Fabrication of microlens array encapsulation layer based on porous film by breath figure method for chip-on-board light-emitting diodes
著者 (7件):
Zhang Zefeng
(School of Mechanical Science & Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China)
,
Guo Xing
(School of Mechanical Science & Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China)
,
Lei Xiang
(School of Mechanical Science & Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China)
,
Wu Jiading
(School of Mechanical Science & Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China)
,
Xu Chunlin
(School of Mechanical Science & Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China)
,
Liu Sheng
(School of Power & Mechanical Engineering, Wuhan University, 430072, China)
,
Zheng Huai
(School of Power & Mechanical Engineering, Wuhan University, 430072, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
ICEPT
ページ:
365-369
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)