文献
J-GLOBAL ID:201602299420032236
整理番号:13A1474772
Study of planarization efficiency of an alkaline copper slurry on 300mm pattern wafer CMP
著者 (7件):
Zheng Weiyan
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
,
Liu Yuling
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
,
Wang Chenwei
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
,
Chuan Liwei
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
,
Wei Wenhao
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
,
Yue Hongwei
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
,
Cao Guanlong
(Inst. of Microelectronics, Hebei Univ. of Technol., Tianjin)
資料名:
Gongneng Cailiao
(Gongneng Cailiao)
巻:
43
号:
24
ページ:
3472-3474
発行年:
2012年
JST資料番号:
C2095A
ISSN:
1001-9731
CODEN:
GOCAEA
資料種別:
逐次刊行物 (A)
発行国:
中国 (CHN)
言語:
中国語 (ZH)