文献
J-GLOBAL ID:201702210461759558
整理番号:17A1506365
ロール接合プロセスにより作製したCu/Sn/Zn三金属被覆の微細構造と引張挙動【Powered by NICT】
Microstructure and tensile behavior of Cu/Sn/Zn trimetallic claddings produced by roll bonding process
著者 (4件):
Mathew Rohit T.
(Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Powai, Mumbai, 400 076, India)
,
Mule Dayanand
(Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Powai, Mumbai, 400 076, India)
,
Balasubramaniam K.R.
(Department of Energy Science and Engineering, Indian Institute of Technology Bombay, Powai, Mumbai, 400 076, India)
,
Prasad M.J.N.V.
(Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Powai, Mumbai, 400 076, India)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
725
ページ:
818-823
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)