文献
J-GLOBAL ID:201702210466201140
整理番号:17A0364009
パッケージにおけるガラスインターポーザベース3Dシステムの製作,組立及び試験【Powered by NICT】
Fabrication, assembly and testing of a glass interposer-based 3D systems in package
著者 (8件):
El Amrani A.
(International University of Rabat-UIR, Technopolis Rabat-Shore, Rocade Rabat-Sale, 11 100 Sala el Jadida, Morocco)
,
El Amrani A.
(Laboratoire de genie electrique et systemes energetiques, Universite Ibn Tofail, Campus Universitaire, Kenitra, Morocco)
,
Demir K.
(3D Systems Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive N.W., Atlanta, GA 30332, United States)
,
Bouya M.
(International University of Rabat-UIR, Technopolis Rabat-Shore, Rocade Rabat-Sale, 11 100 Sala el Jadida, Morocco)
,
Faqir M.
(International University of Rabat-UIR, Technopolis Rabat-Shore, Rocade Rabat-Sale, 11 100 Sala el Jadida, Morocco)
,
Hadjoudja A.
(Laboratoire de genie electrique et systemes energetiques, Universite Ibn Tofail, Campus Universitaire, Kenitra, Morocco)
,
Ghogho M.
(International University of Rabat-UIR, Technopolis Rabat-Shore, Rocade Rabat-Sale, 11 100 Sala el Jadida, Morocco)
,
Ghogho M.
(School of Electronic and Electrical Engineering, University of Leeds, LS2 9JT, UK)
資料名:
Microelectronic Engineering
(Microelectronic Engineering)
巻:
165
ページ:
6-10
発行年:
2016年
JST資料番号:
C0406B
ISSN:
0167-9317
CODEN:
MIENEF
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)