文献
J-GLOBAL ID:201702210539813092
整理番号:17A1555187
熱応力とJoule加熱の影響下でのフリップチップはんだバンプとCuピラーバンプ内の弾性場の有限要素計算【Powered by NICT】
Finite-element calculations of elastic fields within flip-chip solder bumps and Cu-pillar bumps under the influences of thermal stresses and joule heating
著者 (6件):
Zhou Peng
(Department of Astronautics Science and Mechanics, Harbin Institute of Technology, Heilongjiang, 150001, China, P.O. Box 344)
,
Zhao Baojie
(Department of Astronautics Science and Mechanics, Harbin Institute of Technology, Heilongjiang, 150001, China, P.O. Box 344)
,
Zhen Yubao
(Department of Astronautics Science and Mechanics, Harbin Institute of Technology, Heilongjiang, 150001, China, P.O. Box 344)
,
Liu Shuo
(Department of Astronautics Science and Mechanics, Harbin Institute of Technology, Heilongjiang, 150001, China, P.O. Box 344)
,
Hu Yuehua
(Department of Astronautics Science and Mechanics, Harbin Institute of Technology, Heilongjiang, 150001, China, P.O. Box 344)
,
Li Jiayu
(Department of Astronautics Science and Mechanics, Harbin Institute of Technology, Heilongjiang, 150001, China, P.O. Box 344)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
569-574
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)