文献
J-GLOBAL ID:201702212893466091
整理番号:17A0887476
高帯域幅と低コストのための2.5次元ガラスインターポーザBGAパッケージの設計と実証【Powered by NICT】
Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost
著者 (9件):
Sawyer Brett M. D.
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Suzuki Yuya
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Furuya Ryuta
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Nair Chandrasekharan
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Huang Ting-Chia
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Smet Vanessa
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Panayappan Kadappan
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Sundaram Venky
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
,
Tummala Rao
(Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
7
号:
4
ページ:
552-562
発行年:
2017年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)