文献
J-GLOBAL ID:201702214026747916
整理番号:17A1121854
高伸縮性バイアホールへの適用のための磁気自己集合と印刷プロセスによって形成された弾性率勾配導電性コア-シェル構造【Powered by NICT】
Modulus-Gradient Conductive Core-Shell Structures Formed by Magnetic Self-Assembling and Printing Processes for Highly Stretchable Via Applications
著者 (7件):
Oh Eunho
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
,
Byun Junghwan
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
,
Lee Byeongmoon
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
,
Kim Sangwoo
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
,
Kim Daesik
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
,
Yoon Jaeyoung
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
,
Hong Yongtaek
(Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul, 151-744, Republic of Korea)
資料名:
Advanced Electronic Materials
(Advanced Electronic Materials)
巻:
3
号:
3
ページ:
null
発行年:
2017年
JST資料番号:
W2482A
ISSN:
2199-160X
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)