文献
J-GLOBAL ID:201702215516721989
整理番号:17A1392708
Ag~+ベースのインクジェット印刷と迅速な無電解メタライゼーションによるフレキシブル基板上での銅電極の作製【Powered by NICT】
Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization
著者 (11件):
Cai Wen-Ran
(School of Mechanical Engineering, Jiangnan University, Wuxi, China)
,
Chen Yan-Qiu
(School of Mechanical Engineering, Institute of Precision Intelligent System Engineering, Jiangnan University, Wuxi, China)
,
Liu Yu
(School of Mechanical Engineering, Jiangnan University, Wuxi, China)
,
Jin Xiong
(Chengdu Green Energy and Green Manufacturing Technology Research and Development Center, Chengdu, China)
,
Deng Yong-Qiang
(Chengdu Green Energy and Green Manufacturing Technology Research and Development Center, Chengdu, China)
,
Zhang Yong-Zhe
(College of Materials Science and Engineering, Beijing University of Technology, Beijing, China)
,
Zhang Jie
(Changzhou Institute of Printed Electronics Industry, Changzhou, China)
,
Yan Hui
(College of Materials Science and Engineering, Beijing University of Technology, Beijing, China)
,
Gao Wei-Lian
(School of Mechanical Engineering, Institute of Precision Intelligent System Engineering, Jiangnan University, Wuxi, China)
,
Mei Jun
(Chengdu Green Energy and Green Manufacturing Technology Research and Development Center, Chengdu, China)
,
Lau Woon-Ming
(School of Mathematics and Physics, University of Science and Technology Beijing, Beijing, China)
資料名:
IEEE Transactions on Components, Packaging, and Manufacturing Technology
(IEEE Transactions on Components, Packaging, and Manufacturing Technology)
巻:
7
号:
9
ページ:
1552-1559
発行年:
2017年
JST資料番号:
W0590B
ISSN:
2156-3950
CODEN:
ITCPC8
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)