文献
J-GLOBAL ID:201702216819240933
整理番号:17A1637386
信頼性パッケージ応力試験中のウエハレベルチップスケールパッケージ(WLCSP)デバイスに対するナトリウム汚染物質の影響【Powered by NICT】
Impact of sodium-rich contaminant on wafer level chip scale package (WLCSP) devices during reliability package stress test
著者 (7件):
Bailon-Somintac Michelle
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
,
Ison Christine
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
,
Hormigos Giuseppe
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
,
Maturan Jonathan
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
,
Dizon Anacleto
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
,
Dy Dave
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
,
dela Cruz Ramil
(Lattice Semiconductor (PH) Corporation, Lot2A Blk45, Filinvest City, Alabang Zapote Road corner Northbridgeway Avenue, Alabang, Muntinlupa City, 1708 Philippines)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
IPFA
ページ:
1-3
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)