文献
J-GLOBAL ID:201702219066813309
整理番号:17A0407278
Zn添加によるPbフリーはんだ接合におけるサーモマイグレーション誘起Cu基質消費の抑制【Powered by NICT】
Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition
著者 (5件):
Zhong Y.
(Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
,
Zhao N.
(Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
,
Ma H.T.
(Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
,
Dong W.
(Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
,
Huang M.L.
(Electronic Packaging Materials Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
695
ページ:
1436-1443
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)