文献
J-GLOBAL ID:201702219290481057
整理番号:17A0400553
パワーエレクトロニクスモジュールにおけるSn3.5Agはんだ相互接続の信頼性に及ぼす半導体チップの物理的寸法と材料の影響の評価:有限要素解析展望【Powered by NICT】
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective
著者 (5件):
Rajaguru P.
(Computational Mechanics and Reliability Group, University of Greenwich, London, UK)
,
Lu H.
(Computational Mechanics and Reliability Group, University of Greenwich, London, UK)
,
Bailey C.
(Computational Mechanics and Reliability Group, University of Greenwich, London, UK)
,
Ortiz-Gonzalez J.
(School of Engineering, University of Warwick, Coventry, UK)
,
Alatise O.
(School of Engineering, University of Warwick, Coventry, UK)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
68
ページ:
77-85
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)