文献
J-GLOBAL ID:201702221605390536
整理番号:17A0447880
SnBiはんだ合金の微細構造と性質に及ぼす添加ナノスケールCu_6Sn_5粒子の影響【Powered by NICT】
Effects of nanoscale Cu6Sn5 particles addition on microstructure and properties of SnBi solder alloys
著者 (4件):
Li Xuezheng
(Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, People’s Republic of China)
,
Ma Yong
(Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, People’s Republic of China)
,
Zhou Wei
(Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, People’s Republic of China)
,
Wu Ping
(Department of Applied Physics, Institute of Advanced Materials Physics, Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Faculty of Science, Tianjin University, Tianjin 300072, People’s Republic of China)
資料名:
Materials Science & Engineering. A. Structural Materials: Properties, Microstructure and Processing
(Materials Science & Engineering. A. Structural Materials: Properties, Microstructure and Processing)
巻:
684
ページ:
328-334
発行年:
2017年
JST資料番号:
D0589B
ISSN:
0921-5093
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)