文献
J-GLOBAL ID:201702222159147279
整理番号:17A0449147
Cu基板上のプレめっき配向Cu_6Sn_5粒による界面金属間化合物の成長阻害【Powered by NICT】
Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates
著者 (8件):
Yang Ming
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Incheon 21999, Republic of Korea)
,
Ko Yong-Ho
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Incheon 21999, Republic of Korea)
,
Ko Yong-Ho
(Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Bang Junghwan
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Incheon 21999, Republic of Korea)
,
Kim Taek-Soo
(Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Lee Chang-Woo
(Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Incheon 21999, Republic of Korea)
,
Zhang Shuye
(Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291, Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Li Mingyu
(Shenzhen Key Laboratory of Advanced Materials, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, People’s Republic of China)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
701
ページ:
533-541
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)