文献
J-GLOBAL ID:201702222525659157
整理番号:17A0449121
Ti中間層を用いた拡散接合したSiCとReの界面微細構造【Powered by NICT】
Interfacial microstructure of diffusion-bonded SiC and Re with Ti interlayer
著者 (4件):
Kim Joo-Hyung
(Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Kim Dong Seok
(Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
,
Lim Seong Taek
(Agency for Defense Development, Daejeon 305-600, Republic of Korea)
,
Kim Do Kyung
(Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
701
ページ:
316-320
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)