文献
J-GLOBAL ID:201702223134830245
整理番号:17A0316989
低温ダイボンディング材料を用いた発光ダイオードの微細構造と熱的キャラクタリゼーション【Powered by NICT】
Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material
著者 (8件):
Wang Tzu-Hao
(Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan)
,
Lee Hsuan
(Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan)
,
Chen Chih-Ming
(Department of Chemical Engineering, National Chung Hsing University, Taichung 402, Taiwan)
,
Chen Ming-Guan
(Department of Chemical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan)
,
Hu Chi-Chang
(Department of Chemical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan)
,
Chen Yu-Jie
(Graduate Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan)
,
Horng Ray-Hua
(Graduate Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan)
,
Horng Ray-Hua
(Department of Electronics Engineering, National Chiao Tung University, Hsinchu 300, Taiwan)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
63
ページ:
68-75
発行年:
2016年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)