文献
J-GLOBAL ID:201702225238506255
整理番号:17A1127311
低超音波出力の影響下でのCu/SAC305/Cuはんだ継手の微細構造と機械的性質の進展【Powered by NICT】
Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power
著者 (5件):
Tan Ai Ting
(Centre of Advanced Manufacturing and Materials Processing (AMMP), Faculty of Engineering, University Malaya, 50603, Kuala Lumpur, Malaysia)
,
Tan Ai Ting
(Department of Mechanical Engineering, Faculty of Engineering, University Malaya, 50603, Kuala Lumpur, Malaysia)
,
Tan Ai Wen
(Centre of Advanced Manufacturing and Materials Processing (AMMP), Faculty of Engineering, University Malaya, 50603, Kuala Lumpur, Malaysia)
,
Yusof Farazila
(Centre of Advanced Manufacturing and Materials Processing (AMMP), Faculty of Engineering, University Malaya, 50603, Kuala Lumpur, Malaysia)
,
Yusof Farazila
(Department of Mechanical Engineering, Faculty of Engineering, University Malaya, 50603, Kuala Lumpur, Malaysia)
資料名:
Journal of Alloys and Compounds
(Journal of Alloys and Compounds)
巻:
705
ページ:
188-197
発行年:
2017年
JST資料番号:
D0083A
ISSN:
0925-8388
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)