文献
J-GLOBAL ID:201702226670158769
整理番号:17A0329208
高密度ファンアウトウエハレベルパッケージの落下衝撃信頼性研究【Powered by NICT】
Drop impact reliability study of high density fan-out wafer level package
著者 (6件):
Chen Zhaohui
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionnopolis Way, #08-02, Innovis, Singapore, 138634)
,
Che Faxing
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionnopolis Way, #08-02, Innovis, Singapore, 138634)
,
Ding Mian Zhi
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionnopolis Way, #08-02, Innovis, Singapore, 138634)
,
Ho David Soon Wee
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionnopolis Way, #08-02, Innovis, Singapore, 138634)
,
Chai Tai Chong
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionnopolis Way, #08-02, Innovis, Singapore, 138634)
,
Rao Vempati Srinivasa
(Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), 2 Fusionnopolis Way, #08-02, Innovis, Singapore, 138634)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2016
号:
EPTC
ページ:
771-778
発行年:
2016年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)