文献
J-GLOBAL ID:201702227397894436
整理番号:17A0079606
セラミックナノ粒子で強化したSn3.0Ag0.5Cuはんだペーストによる鉛フリーはんだ接合の形態および剪断強さ
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
著者 (10件):
Yakymovych A.
(Department of Inorganic Chemistry - Functional Materials, University of Vienna, Vienna, Austria)
,
Yakymovych A.
(Department of Metal Physics, Ivan Franko National University, Lviv, Ukraine)
,
Plevachuk Yu.
(Department of Metal Physics, Ivan Franko National University, Lviv, Ukraine)
,
Svec P. Sr.
(Department of Metal Physics, Institute of Physics, Slovak Academy of Sciences, Bratislava, Slovakia)
,
Svec P.
(Department of Metal Physics, Institute of Physics, Slovak Academy of Sciences, Bratislava, Slovakia)
,
Janickovic D.
(Department of Metal Physics, Institute of Physics, Slovak Academy of Sciences, Bratislava, Slovakia)
,
Sebo P.
(Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovakia)
,
Beronska N.
(Institute of Materials and Machine Mechanics, Slovak Academy of Sciences, Bratislava, Slovakia)
,
Roshanghias A.
(Department of Inorganic Chemistry - Functional Materials, University of Vienna, Vienna, Austria)
,
Ipser H.
(Department of Inorganic Chemistry - Functional Materials, University of Vienna, Vienna, Austria)
資料名:
Journal of Electronic Materials
(Journal of Electronic Materials)
巻:
45
号:
12
ページ:
6143-6149
発行年:
2016年12月
JST資料番号:
D0277B
ISSN:
0361-5235
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
ドイツ (DEU)
言語:
英語 (EN)