文献
J-GLOBAL ID:201702227562079478
整理番号:17A1705423
ワイヤボンディングパッケージにおける理解腐食挙動のPdドープCuとPdをドープしたCu-Al金属間化合物の電気化学的研究【Powered by NICT】
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
著者 (4件):
Wu Yuelin
(Dept. of Chemical Engineering and Materials Science, Michigan State University, East Lansing, MI 48824, United States)
,
Subramanian K.N.
(Dept. of Chemical Engineering and Materials Science, Michigan State University, East Lansing, MI 48824, United States)
,
Barton Scott Calabrese
(Dept. of Chemical Engineering and Materials Science, Michigan State University, East Lansing, MI 48824, United States)
,
Lee Andre
(Dept. of Chemical Engineering and Materials Science, Michigan State University, East Lansing, MI 48824, United States)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
78
ページ:
355-361
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)