文献
J-GLOBAL ID:201702227680953513
整理番号:17A1555156
パッケージのKaバンドミリ波送受信システムの熱応力協調シミュレーション【Powered by NICT】
Thermal-stress co-simulation of a Ka-band millimeter-wave T/R System in Package
著者 (7件):
Xu Gang
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
,
Zhong Wei
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
,
Zeng Rong
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
,
Li Zhaorong
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
,
Huang Xuejiao
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
,
Li Zhipeng
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
,
Lv Liming
(Research Center of Microwave and Millimeter wave Technology, Institute of Electonic Engineering, Academy of Engineering Physics, Mianyang, 621900, China)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
ICEPT
ページ:
436-439
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)