文献
J-GLOBAL ID:201702228401092050
整理番号:17A0402417
需要に及ぼす体積加法過程による直接光パターン形成法に基づく大規模フレキシブル導電性銅-銀パターン【Powered by NICT】
Large-scale flexible conductive copper-silver pattern based on direct photo-patterning via volume additive process on demand
著者 (4件):
Wang Bowen
(State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029, PR China)
,
Hu Dongdong
(State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029, PR China)
,
Nie Jun
(State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029, PR China)
,
Zhu Xiaoqun
(State Key Laboratory of Chemical Resource Engineering, Beijing University of Chemical Technology, Beijing 100029, PR China)
資料名:
Materials Letters
(Materials Letters)
巻:
188
ページ:
296-299
発行年:
2017年
JST資料番号:
E0935A
ISSN:
0167-577X
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
オランダ (NLD)
言語:
英語 (EN)