文献
J-GLOBAL ID:201702228578451294
整理番号:17A1260937
次世代無線相互接続した三次元集積回路のためのチップレベルの無線電力伝送方式の設計【Powered by NICT】
Chip-level wireless power transfer scheme design for next generation wireless interconnected three-dimensional integrated circuits
著者 (6件):
Song Jinwook
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea)
,
Jeong Seungtaek
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea)
,
Park Shinyoung
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea)
,
Kim Jonghoon
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea)
,
Hong Seokwoo
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea)
,
Kim Joungho
(Department of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea)
資料名:
IEEE Conference Proceedings
(IEEE Conference Proceedings)
巻:
2017
号:
WPTC
ページ:
1-4
発行年:
2017年
JST資料番号:
W2441A
資料種別:
会議録 (C)
記事区分:
原著論文
発行国:
アメリカ合衆国 (USA)
言語:
英語 (EN)