文献
J-GLOBAL ID:201702229644651316
整理番号:17A1999405
進行Back-End-Of-Line相互接続の機械的完全性に及ぼすバイアの密度と不動態化の厚さの影響【Powered by NICT】
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
著者 (13件):
Kljucar Luka
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Kljucar Luka
(Department of Materials Engineering, KU Leuven, Leuven, Belgium)
,
Gonzalez Mario
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Croes Kristof
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
De Wolf Ingrid
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
De Wolf Ingrid
(Department of Materials Engineering, KU Leuven, Leuven, Belgium)
,
De Messemaeker Joke
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Murdoch Gayle
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Nolmans Philip
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
De Vos Joeri
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Bommels Juergen
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Beyne Eric
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
,
Toekei Zsolt
(imec, Kapeldreef 75, 3001 Leuven, Belgium)
資料名:
Microelectronics Reliability
(Microelectronics Reliability)
巻:
79
ページ:
297-305
発行年:
2017年
JST資料番号:
C0530A
ISSN:
0026-2714
資料種別:
逐次刊行物 (A)
記事区分:
原著論文
発行国:
イギリス (GBR)
言語:
英語 (EN)